Semiconductor device fabrication

Results: 2185



#Item
41Inside Front Cover: Defect Tolerance and Nanomechanics in Transistors that Use Semiconductor Nanomaterials and Ultrathin Dielectrics (Adv. Funct. Mater)

Inside Front Cover: Defect Tolerance and Nanomechanics in Transistors that Use Semiconductor Nanomaterials and Ultrathin Dielectrics (Adv. Funct. Mater)

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Source URL: rogers.matse.illinois.edu

Language: English - Date: 2008-09-08 15:02:12
42sedb.com  Revolutionising Electronics IC design in Singapore

sedb.com Revolutionising Electronics IC design in Singapore

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Source URL: www.edb.gov.sg

Language: English - Date: 2016-08-22 05:58:57
43Journal of Undergraduate Research 6, Analysis of Ferromagnetic-Multiferroic Interfaces in Epitaxial Multilayers of La0.7 Sr0.3 MnO3 and BiFeO3 P. Knapp Department of Mechanical Engineering, Northwestern Uni

Journal of Undergraduate Research 6, Analysis of Ferromagnetic-Multiferroic Interfaces in Epitaxial Multilayers of La0.7 Sr0.3 MnO3 and BiFeO3 P. Knapp Department of Mechanical Engineering, Northwestern Uni

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Source URL: jur.phy.uic.edu

Language: English - Date: 2013-04-17 12:16:50
44One-dimensional carrier profiling of blanket and confined semiconducting structures Promoter: Prof. Dr. Ir. W. Vandervorst Contact and daily advisor: Dr. Ir. J. Bogdanowicz () Required backgroun

One-dimensional carrier profiling of blanket and confined semiconducting structures Promoter: Prof. Dr. Ir. W. Vandervorst Contact and daily advisor: Dr. Ir. J. Bogdanowicz () Required backgroun

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Source URL: www.montefiore.ulg.ac.be

Language: English - Date: 2016-06-08 02:28:36
45Advanced IC Process Characterization Tool Puts Reliability Data in Hands of Fabless Design Houses ProChek™ Measures Critical DSM Degradation Effects in Hours, Not Weeks Anaheim, California, September 19, Ridget

Advanced IC Process Characterization Tool Puts Reliability Data in Hands of Fabless Design Houses ProChek™ Measures Critical DSM Degradation Effects in Hours, Not Weeks Anaheim, California, September 19, Ridget

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Source URL: www.ridgetopgroup.com

Language: English - Date: 2015-07-18 01:30:10
46Journal of Undergraduate Research 4, Selective Atomic Layer Deposition (SALD) of Titanium Dioxide on Silicon and Copper Patterned Substrates K. Overhage Department of Chemical Engineering, Purdue University, I

Journal of Undergraduate Research 4, Selective Atomic Layer Deposition (SALD) of Titanium Dioxide on Silicon and Copper Patterned Substrates K. Overhage Department of Chemical Engineering, Purdue University, I

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Source URL: jur.phy.uic.edu

Language: English - Date: 2011-03-09 12:29:52
47SUEX Dry Film Resist – A new Material for High Aspect Ratio Lithography Donald W Johnsona, Jost Goettertb, Varshni Singhb and Dawit Yemaneb a  b

SUEX Dry Film Resist – A new Material for High Aspect Ratio Lithography Donald W Johnsona, Jost Goettertb, Varshni Singhb and Dawit Yemaneb a b

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Source URL: camd.lsu.edu

Language: English - Date: 2012-08-02 10:13:02
48MAJOR FACILITIES  TSMC SPOKESPERSON Corporate Headquarters & FAB 2, FAB 5 No.121, Park Ave. III,

MAJOR FACILITIES TSMC SPOKESPERSON Corporate Headquarters & FAB 2, FAB 5 No.121, Park Ave. III,

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Source URL: www.tsmc.com

Language: English - Date: 2010-12-13 08:48:27
49Flexible Vertical LEDs  Flexible Vertical Light Emitting Diodes Rak-Hwan Kim, Stanley Kim, Young Min Song, Hyejin Jeong, Tae-il Kim, Jongho Lee, Xuling Li, Kent D. Choquette, and John A. Rogers* Recently developed concep

Flexible Vertical LEDs Flexible Vertical Light Emitting Diodes Rak-Hwan Kim, Stanley Kim, Young Min Song, Hyejin Jeong, Tae-il Kim, Jongho Lee, Xuling Li, Kent D. Choquette, and John A. Rogers* Recently developed concep

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Source URL: rogers.matse.illinois.edu

Language: English - Date: 2012-11-19 12:59:11
50APPLIED PHYSICS LETTERS  VOLUME 82, NUMBERMAY 2003

APPLIED PHYSICS LETTERS VOLUME 82, NUMBERMAY 2003

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Source URL: www.diee.unica.it

Language: English - Date: 2009-07-13 07:57:34